Optimization of the Cu wire bonding process for IC assembly using Taguchi methods
| dc.citation.epage | 59 | en_US |
| dc.citation.issue | 1 | en_US |
| dc.citation.spage | 53 | en_US |
| dc.citation.volume | 51 | en_US |
| dc.citation.woscount | 15 | |
| dc.contributor.author | Su, Chao-Ton | en_US |
| dc.contributor.author | Yeh, Cheng-Jung | en_US |
| dc.contributor.department | 工業工程與管理學系 | zh_TW |
| dc.contributor.department | Department of Industrial Engineering and Management | en_US |
| dc.date.accessioned | 2014-12-08T15:38:00Z | |
| dc.date.available | 2014-12-08T15:38:00Z | |
| dc.date.issued | 2011-01-01 | en_US |
| dc.description.abstract | The yield of IC assembly manufacturing is dependent on wire bonding. Recently, the semiconductor industry demands smaller IC designs and higher performance requirements. As such, bonding wires must be stronger, finer, and more solid. The cost of gold is continuously appreciating, and this has become a key issue in IC assembly and design. Copper wire bonding is an alternative solution to this problem. It is expected to be superior over Au wires in terms of cost, quality, and fine-pitch bonding pad design. To obtain the best wire bonding quality, we employed Taguchi methods in optimizing the Cu wire bonding process. With Cu wire bonding technology, the production yield increased from 98.5% to 99.3% and brought approximately USD 0.7 million in savings. (C) 2010 Elsevier Ltd. All rights reserved. | en_US |
| dc.identifier.doi | 10.1016/j.microrel.2010.09.007 | en_US |
| dc.identifier.issn | 0026-2714 | en_US |
| dc.identifier.journal | MICROELECTRONICS RELIABILITY | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1016/j.microrel.2010.09.007 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/26093 | |
| dc.identifier.wosnumber | WOS:000287057500010 | |
| dc.language.iso | en_US | en_US |
| dc.title | Optimization of the Cu wire bonding process for IC assembly using Taguchi methods | en_US |
| dc.type | Article | en_US |