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Characterization and modeling of trap number and creation time distributions under negative-bias-temperature stress

dc.citation.epageen_US
dc.citation.issue8en_US
dc.citation.volume101en_US
dc.citation.woscount1
dc.contributor.authorChiu, Jung-Piaoen_US
dc.contributor.authorLi, Chi-Weien_US
dc.contributor.authorWang, Tahuien_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:24:18Z
dc.date.available2014-12-08T15:24:18Z
dc.date.issued2012-08-20en_US
dc.description.abstractIndividual trapped charge creations and a trap number in p-type metal-oxide-semiconductor field effect transistors (pMOSFETs) under negative bias temperature instability (NBTI) stress are investigated. We find that the characteristic times of a trapped charge creation scatter over several decades of time in small area pMOSFETs, which is attributed to an activation energy distribution in the reaction-diffusion (RD) model of NBTI. We develop a statistical model by combining the RD model with an extracted activation energy distribution to calculate a threshold voltage shift distribution at different NBTI stress times. Our model agrees with measured results very well. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4748108]en_US
dc.identifier.doi10.1063/1.4748108en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4748108en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/16903
dc.identifier.wosnumberWOS:000308420800071
dc.language.isoen_USen_US
dc.titleCharacterization and modeling of trap number and creation time distributions under negative-bias-temperature stressen_US
dc.typeArticleen_US

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