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Impacts of precursor flow rate and temperature of PECVD-SiN capping films on strained-channel NMOSFETs

dc.citation.epage336en_US
dc.citation.spage335en_US
dc.contributor.authorLu, Ching-Senen_US
dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorLee, Yao-Jenen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:16:17Z
dc.date.available2014-12-08T15:16:17Z
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-1891-6en_US
dc.identifier.journal2007 INTERNATIONAL SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM, VOLS 1 AND 2en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/12067
dc.identifier.wosnumberWOS:000255857100172
dc.language.isoen_USen_US
dc.titleImpacts of precursor flow rate and temperature of PECVD-SiN capping films on strained-channel NMOSFETsen_US
dc.typeProceedings Paperen_US

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