多層導體連線平坦化之研究---電鍍銅之電解拋光技術
| dc.contributor.author | 馮明憲 | en_US |
| dc.contributor.department | 國立交通大學材料科學工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:39:50Z | |
| dc.date.available | 2014-12-13T10:39:50Z | |
| dc.date.issued | 2001 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC90-2215-E009-062 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=665679&docId=126368 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/96852 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 平坦化 | zh_TW |
| dc.subject | 多層連結線 | zh_TW |
| dc.subject | 電解拋光 | zh_TW |
| dc.subject | 電鍍銅 | zh_TW |
| dc.subject | Planarization | en_US |
| dc.subject | Multilayer interconnect | en_US |
| dc.subject | Electropolishing | en_US |
| dc.subject | Electroplated copper | en_US |
| dc.title | 多層導體連線平坦化之研究---電鍍銅之電解拋光技術 | zh_TW |
| dc.title | Planarization Investigation of Multi-layer Interconnects---Electropolishing Technology for Electroplated Copper | en_US |
| dc.type | Plan | en_US |
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