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Micro knife-edge optical measurement device in a silicon-on-insulator substrate

dc.citation.epage6373en_US
dc.citation.issue10en_US
dc.citation.spage6367en_US
dc.citation.volume15en_US
dc.citation.woscount7
dc.contributor.authorChiu, Yien_US
dc.contributor.authorPan, Jiun-Hungen_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.date.accessioned2014-12-08T15:14:02Z
dc.date.available2014-12-08T15:14:02Z
dc.date.issued2007-05-14en_US
dc.description.abstractThe knife-edge method is a commonly used technique to characterize the optical profiles of laser beams or focused spots. In this paper, we present a micro knife-edge scanner fabricated in a silicon-on-insulator substrate using the micro-electromechanical-system technology. A photo detector can be fabricated in the device to allow further integration with on-chip signal conditioning circuitry. A novel backside deep reactive ion etching process is proposed to solve the residual stress effect due to the buried oxide layer. Focused optical spot profile measurement is demonstrated. (C) 2007 Optical Society of America.en_US
dc.identifier.doi10.1364/OE.15.006367en_US
dc.identifier.issn1094-4087en_US
dc.identifier.journalOPTICS EXPRESSen_US
dc.identifier.urihttp://dx.doi.org/10.1364/OE.15.006367en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/10801
dc.identifier.wosnumberWOS:000246474300050
dc.language.isoen_USen_US
dc.titleMicro knife-edge optical measurement device in a silicon-on-insulator substrateen_US
dc.typeArticleen_US

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