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The mechanisms of random trap fluctuation in metal oxide semiconductor field effect transistors

dc.citation.epageen_US
dc.citation.issue22en_US
dc.citation.volume101en_US
dc.citation.woscount3
dc.contributor.authorHsieh, E. R.en_US
dc.contributor.authorChung, Steve S.en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:28:53Z
dc.date.available2014-12-08T15:28:53Z
dc.date.issued2012-11-26en_US
dc.description.abstractAn effect, called random trap fluctuation (RTF), is proposed to study the threshold voltage (V-th) fluctuation of metal oxide semiconductor field effect transistors (MOSFETs) under Fowler-Nordeim (FN) or hot carrier (HC) stress condition. Experiments have been demonstrated on n-channel MOSFETs, and it was found that not only the random dopant fluctuation (RDF) but also the stress-induced traps vary the V-th fluctuation. More importantly, the stress-induced trap barrier determines the V-th fluctuation. For devices after FN stress, V-th fluctuation is enhanced since the trap barrier regulates the transporting carriers. For devices after HC stress, V-th fluctuation is supressed since the carriers are backscattered into the channel by the trap barrier and fewer carriers with higher energy pass through the barrier. These results provide us a clear understanding on another source of V-th fluctuations in addition to the RDF as devices are further scaled. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4768687]en_US
dc.identifier.doi10.1063/1.4768687en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4768687en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/20870
dc.identifier.wosnumberWOS:000311967000085
dc.language.isoen_USen_US
dc.titleThe mechanisms of random trap fluctuation in metal oxide semiconductor field effect transistorsen_US
dc.typeArticleen_US

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