<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

具實用性及交期導向之IC封裝廠排程演算法則之設計與應用

dc.contributor.author彭文理en_US
dc.contributor.authorWEN LEAPEARNen_US
dc.contributor.department國立交通大學工業工程與管理學系zh_TW
dc.date.accessioned2014-12-13T10:35:46Z
dc.date.available2014-12-13T10:35:46Z
dc.date.issued2001en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC90-2218-E009-019zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=674285&docId=128524en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/93590
dc.language.isozh_TWen_US
dc.subjectIC封裝zh_TW
dc.subject排程zh_TW
dc.subject演算法zh_TW
dc.subject交期指定zh_TW
dc.subject實用性zh_TW
dc.subjectIC packagingen_US
dc.subjectSchedulingen_US
dc.subjectAlgorithmen_US
dc.subjectDue date assignmenten_US
dc.subjectPracticabilityen_US
dc.title具實用性及交期導向之IC封裝廠排程演算法則之設計與應用zh_TW
dc.titleThe Design and Application of the Algorithms with Practicability and Due-Date Orientation for Solving the IC Packaging Scheduling Problem (ICPSP)en_US
dc.typePlanen_US

Files

Original bundle

Now showing 1 - 2 of 2
Loading...
Thumbnail Image
Name:
902218E009019.pdf
Size:
316.23 KB
Format:
Adobe Portable Document Format
Loading...
Thumbnail Image
Name:
902218E009019.pdf
Size:
316.23 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: