Introduction to the special issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
| dc.citation.epage | 167 | en_US |
| dc.citation.issue | 2 | en_US |
| dc.citation.spage | 167 | en_US |
| dc.citation.volume | 5 | en_US |
| dc.citation.woscount | 1 | |
| dc.contributor.author | Pey, KL | en_US |
| dc.contributor.author | Trigg, A | en_US |
| dc.contributor.author | Chung, S | en_US |
| dc.contributor.department | 交大名義發表 | zh_TW |
| dc.contributor.department | National Chiao Tung University | en_US |
| dc.date.accessioned | 2014-12-08T15:19:03Z | |
| dc.date.available | 2014-12-08T15:19:03Z | |
| dc.date.issued | 2005-06-01 | en_US |
| dc.identifier.doi | 10.1109/TDMR.2005.849903 | en_US |
| dc.identifier.issn | 1530-4388 | en_US |
| dc.identifier.journal | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/TDMR.2005.849903 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/13677 | |
| dc.identifier.wosnumber | WOS:000230223000001 | |
| dc.language.iso | en_US | en_US |
| dc.title | Introduction to the special issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) | en_US |
| dc.type | Editorial Material | en_US |