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Inert Pt electrode switching mechanism after controlled polarity-forming process in In2O3-based resistive random access memory

dc.citation.volume10en_US
dc.contributor.authorWu, Cheng-Hsienen_US
dc.contributor.authorPan, Chih-Hungen_US
dc.contributor.authorChen, Po-Hsunen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorShih, Chih-Chengen_US
dc.contributor.authorChi, Ting-Yangen_US
dc.contributor.authorChu, Tian-Jianen_US
dc.contributor.authorWu, Jia-Jien_US
dc.contributor.authorDu, Xiaoqinen_US
dc.contributor.authorZheng, Hao-Xuanen_US
dc.contributor.authorSze, Simon M.en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2018-08-21T05:54:30Z
dc.date.available2018-08-21T05:54:30Z
dc.date.issued2017-09-01en_US
dc.description.abstractIn this study, we demonstrate a forming technique that enables us to control whether the switching layer of a Pt/In2O3/TiN device is near the Pt electrode or the TiN electrode. This means that In2O3-based resistive random access memory (RRAM) can be switched at either the active or inert electrode. The resistive switching current-voltage (I-V) curves for both electrodes exhibit stable memory windows. Through material and electrical analyses, we found that the reason for switching at the inert electrode is the oxygen-vacancy-rich characteristic of In2O3. Finally, a physical model is proposed to explain this phenomenon. (C) 2017 The Japan Society of Applied Physicsen_US
dc.identifier.doi10.7567/APEX.10.094102en_US
dc.identifier.issn1882-0778en_US
dc.identifier.journalAPPLIED PHYSICS EXPRESSen_US
dc.identifier.urihttp://dx.doi.org/10.7567/APEX.10.094102en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/146041
dc.identifier.wosnumberWOS:000409489000001en_US
dc.language.isoen_USen_US
dc.titleInert Pt electrode switching mechanism after controlled polarity-forming process in In2O3-based resistive random access memoryen_US
dc.typeArticleen_US

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