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Enhanced green laser activation by antireflective gate structures in panel transistors

dc.citation.epageen_US
dc.citation.issue6en_US
dc.citation.volume92en_US
dc.citation.woscount10
dc.contributor.authorShieh, Jia-Minen_US
dc.contributor.authorChen, Chihen_US
dc.contributor.authorLin, Yu-Tingen_US
dc.contributor.authorPan, Ci-Lingen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:12:36Z
dc.date.available2014-12-08T15:12:36Z
dc.date.issued2008-02-11en_US
dc.description.abstractAntireflective gate structures of polycrystalline silicon (poly-Si) and silicon dioxide films enable postimplantation green continuous-wave laser annealing of all Si regions of green laser-crystallized panel Si transistors. About 40% of the incident laser-energy penetrates to the channels, owing to antireflective gate structures with the absorptive gate poly-Si, while 65% of the incident laser-energy enters the source/drain regions because of Fresnel reflections at the air/source (drain) interfaces. Such inverted laser-energy profiles and ascendant defect distributions along the channels/junctions/contact regions, yielded continuous, improved epilike Si microstructures over the entire active layer. The electron mobility of the transistors, 620 cm(2)/V s, approaches that of integrated-circuits transistors. (C) 2008 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2842417en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2842417en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/9682
dc.identifier.wosnumberWOS:000253237900108
dc.language.isoen_USen_US
dc.titleEnhanced green laser activation by antireflective gate structures in panel transistorsen_US
dc.typeArticleen_US

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