積體電路化學品與材料之開發---子計畫II：化學機械研磨材料於積體電路製程之應用研究(II)
| dc.contributor.author | 馮明憲 | en_US |
| dc.contributor.department | 交通大學材料科學與工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:36:49Z | |
| dc.date.available | 2014-12-13T10:36:49Z | |
| dc.date.issued | 1999 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC88-CPC-E009-015 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=461617&docId=84632 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94189 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 化學機械拋光 | zh_TW |
| dc.subject | 積體電路 | zh_TW |
| dc.subject | 製程 | zh_TW |
| dc.subject | Chemical mechanical polishing | en_US |
| dc.subject | Integral circuit (IC) | en_US |
| dc.subject | Process | en_US |
| dc.title | 積體電路化學品與材料之開發---子計畫II：化學機械研磨材料於積體電路製程之應用研究(II) | zh_TW |
| dc.title | Application of Chemical Mechanical Polishing Materials in IC Manufacturing (II) | en_US |
| dc.type | Plan | en_US |