Critical length of electromigration for eutectic SnPb solder stripe
| dc.citation.epage | en_US | |
| dc.citation.issue | 18 | en_US |
| dc.citation.volume | 88 | en_US |
| dc.citation.woscount | 14 | |
| dc.contributor.author | Wei, CC | en_US |
| dc.contributor.author | Chen, C | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:16:37Z | |
| dc.date.available | 2014-12-08T15:16:37Z | |
| dc.date.issued | 2006-05-01 | en_US |
| dc.description.abstract | The critical length of eutectic SnPb solder was investigated using solder stripes. By employing focus ion beam, solder stripes of various lengths, including 5, 10, 15, 20, 30, 100, and 200 mu m, can be fabricated. Length-dependent electromigration behavior was observed, which implies that there may be back stress under stressing. The critical length was determined to be between 10 and 15 mu m under stressing by 2x10(4) A/cm(2) at 100 degrees C, and the corresponding critical product was between 20 and 30 A/cm. Both values show good agreement with their theoretical values. (c) 2006 American Institute of Physics. | en_US |
| dc.identifier.doi | 10.1063/1.2200158 | en_US |
| dc.identifier.issn | 0003-6951 | en_US |
| dc.identifier.journal | APPLIED PHYSICS LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1063/1.2200158 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/12269 | |
| dc.identifier.wosnumber | WOS:000237321600043 | |
| dc.language.iso | en_US | en_US |
| dc.title | Critical length of electromigration for eutectic SnPb solder stripe | en_US |
| dc.type | Article | en_US |