高密度多層構裝基板與接合材料研究---子計畫II：銅接合-低介電係數介電層之界面可靠度提升研究
| dc.contributor.author | 邱碧秀 | en_US |
| dc.contributor.author | CHIOU BI-SHIOU | en_US |
| dc.contributor.department | 交通大學電子工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:30:32Z | |
| dc.date.available | 2014-12-13T10:30:32Z | |
| dc.date.issued | 2000 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC89-2216-E009-017 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=720602&docId=135385 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/90308 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 高密度多層構裝基板與接合材料研究---子計畫II：銅接合-低介電係數介電層之界面可靠度提升研究 | zh_TW |
| dc.title | Reliability Enhancement for Copper Interconnect-Low K Dielectric Interconnect | en_US |
| dc.type | Plan | en_US |