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Characterization of Ultra-Thin Ni Silicide Film by Two-Step Low Temperature Microwave Anneal

dc.citation.epageP125en_US
dc.citation.issue5en_US
dc.citation.spageP122en_US
dc.citation.volume3en_US
dc.citation.woscount0
dc.contributor.authorWu, Chien-Tingen_US
dc.contributor.authorLee, Yao-Jenen_US
dc.contributor.authorHsueh, Fu-Kuoen_US
dc.contributor.authorSung, Po-Jungen_US
dc.contributor.authorCho, Ta-Chunen_US
dc.contributor.authorCurrent, Michael Iraen_US
dc.contributor.authorChao, Tien-Shengen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.date.accessioned2014-12-08T15:35:58Z
dc.date.available2014-12-08T15:35:58Z
dc.date.issued2014en_US
dc.description.abstractA novel silicide process with two-step low temperature microwave annealing (MWA) achieves NiSi thickness of 10 nm while maintaining low resistance, and an ultra-thin Ni silicide film, only 4.5 nm, has been realized. In this MWA system, we insert quartz and Si susceptors to change the absorption efficiency of the process wafer and provide fine turning in temperature control during annealing. The thickness of NiSi film is determined by microwave power and by changing the number and the position of quartz and Si susceptors in the first step of the anneal process. The STEM-HAADF combined EELS/EDS spectroscopies are used to analyze the electronic excitations and identify the phase of Ni silicide. (C) 2014 The Electrochemical Society. [DOI: 10.1149/2.006405jss] All rights reserved.en_US
dc.identifier.doi10.1149/2.006405jssen_US
dc.identifier.issn2162-8769en_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.006405jssen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/24329
dc.identifier.wosnumberWOS:000334161400007
dc.language.isoen_USen_US
dc.titleCharacterization of Ultra-Thin Ni Silicide Film by Two-Step Low Temperature Microwave Annealen_US
dc.typeArticleen_US

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