8吋矽晶圓半導體LPCVD製程設備之研發---子計畫II：LPCVD製程設備中加熱系統之熱輻射量測及晶圓熱應力分析(III)
| dc.contributor.author | 曲新生 | en_US |
| dc.contributor.author | CHU, HSIN-SEN | en_US |
| dc.contributor.department | 交通大學機械工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:37:14Z | |
| dc.date.available | 2014-12-13T10:37:14Z | |
| dc.date.issued | 1999 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC88-2218-E009-003 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=428997&docId=76781 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94471 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 低壓化學氣相沈積法 | zh_TW |
| dc.subject | 晶圓 | zh_TW |
| dc.subject | 熱應力 | zh_TW |
| dc.subject | 快速熱處理 | zh_TW |
| dc.subject | 熱輻射 | zh_TW |
| dc.subject | LPCVD | en_US |
| dc.subject | Wafer | en_US |
| dc.subject | Thermal stress | en_US |
| dc.subject | Rapid thermal process (RTP) | en_US |
| dc.subject | Thermal radiation | en_US |
| dc.title | 8吋矽晶圓半導體LPCVD製程設備之研發---子計畫II：LPCVD製程設備中加熱系統之熱輻射量測及晶圓熱應力分析(III) | zh_TW |
| dc.title | Study on the Heating System of LPCVD Process Equipment and Thermal Stress of Wafer (III) | en_US |
| dc.type | Plan | en_US |