高性能混和訊號式介面積體電路-子計畫三：5 GHz高性能無線通訊系統中主要積體電路的設計與整合(III)
| dc.contributor.author | 吳重雨 | en_US |
| dc.contributor.author | CHUNG-YUWU | en_US |
| dc.contributor.department | 交通大學電子工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:31:39Z | |
| dc.date.available | 2014-12-13T10:31:39Z | |
| dc.date.issued | 2004 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC93-2215-E009-017 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1026651&docId=195167 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/91091 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 高性能混和訊號式介面積體電路-子計畫三：5 GHz高性能無線通訊系統中主要積體電路的設計與整合(III) | zh_TW |
| dc.title | The Design and Integration of Key Component ICs for 5 GHz High Performance Wireless Communication System(III) | en_US |
| dc.type | Plan | en_US |