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Development of a Three Dimensional Neural Sensing Device by a Stacking Method (vol 10, pg 4238, 2010)

dc.citation.epage4716en_US
dc.citation.issue5en_US
dc.citation.spage4716en_US
dc.citation.volume10en_US
dc.citation.woscount0
dc.contributor.authorChang, Chih-Weien_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.date.accessioned2014-12-08T15:07:01Z
dc.date.available2014-12-08T15:07:01Z
dc.date.issued2010-05-01en_US
dc.identifier.doi10.3390/s100504716en_US
dc.identifier.issn1424-8220en_US
dc.identifier.journalSENSORSen_US
dc.identifier.urihttp://dx.doi.org/10.3390/s100504716en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/5486
dc.identifier.wosnumberWOS:000278105100028
dc.language.isoen_USen_US
dc.titleDevelopment of a Three Dimensional Neural Sensing Device by a Stacking Method (vol 10, pg 4238, 2010)en_US
dc.typeCorrectionen_US

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