Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
| dc.citation.epage | 1837 | en_US |
| dc.citation.spage | 1834 | en_US |
| dc.citation.volume | 46A | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Cheng, Hsi-Kuei | en_US |
| dc.contributor.author | Lin, Yu-Jie | en_US |
| dc.contributor.author | Chang, Hou-Chien | en_US |
| dc.contributor.author | Liu, Kuo-Chio | en_US |
| dc.contributor.author | Wang, Ying-Lang | en_US |
| dc.contributor.author | Liu, Tzeng-Feng | en_US |
| dc.contributor.author | Chen, Chih-Ming | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | 照明與能源光電研究所 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.contributor.department | Institute of Lighting and Energy Photonics | en_US |
| dc.date.accessioned | 2015-07-21T08:29:25Z | |
| dc.date.available | 2015-07-21T08:29:25Z | |
| dc.date.issued | 2015-05-01 | en_US |
| dc.description.abstract | The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar\'s morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015 | en_US |
| dc.identifier.doi | 10.1007/s11661-015-2825-4 | en_US |
| dc.identifier.issn | 1073-5623 | en_US |
| dc.identifier.journal | METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1007/s11661-015-2825-4 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/124450 | |
| dc.identifier.wosnumber | WOS:000351527200002 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing | en_US |
| dc.type | Article | en_US |
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