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Applications of mu c-SiOx:H as integrated n-layer and back transparent conductive oxide for a-Si:H/mu c-Si:H tandem cells

dc.citation.epageen_US
dc.citation.issue5en_US
dc.citation.volume53en_US
dc.citation.woscount0
dc.contributor.authorLiang, Shin-Weien_US
dc.contributor.authorHuang, Yen-Tangen_US
dc.contributor.authorHsu, Hung-Jungen_US
dc.contributor.authorHsu, Cheng-Hangen_US
dc.contributor.authorTsai, Chuang-Chuangen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:36:36Z
dc.date.available2014-12-08T15:36:36Z
dc.date.issued2014-05-01en_US
dc.description.abstractWe have prepared n-type hydrogenated microcrystalline silicon oxide [mu c-SiOx:H(n)] films with oxygen contents from 0 to 37.3 at. % by varying the CO2-to-SiH4 flow ratio in a plasma-enhanced chemical vapor deposition (PECVD) system. By using mu c-SiOx:H(n) as an effective replacement for integrated mu c-Si:H(n) and indium-tin oxide (ITO), mu c-Si:H single-junction and a-Si:H/mu c-Si:H tandem cells exhibited significantly improved efficiencies of 6.35 and 10.53%, respectively. The improvement of the single-junction and tandem cells mainly arose from the enhancement of long-wavelength optical absorption in mu c-Si:H absorbers, which was confirmed by a quantum efficiency instrument showing a markedly enhanced spectral response at wavelengths from 600 to 1100 nm. Moreover, all the PECVD processes, except the metal contact, had an advantage of in situ deposition without breaking vacuum, thereby minimizing contamination of the interface. The simplified cell fabrication can enhance the fill factor, which will benefit industrial production. (C) 2014 The Japan Society of Applied Physicsen_US
dc.identifier.doi10.7567/JJAP.53.05FV08en_US
dc.identifier.issn0021-4922en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.identifier.urihttp://dx.doi.org/10.7567/JJAP.53.05FV08en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/24942
dc.identifier.wosnumberWOS:000338316200138
dc.language.isoen_USen_US
dc.titleApplications of mu c-SiOx:H as integrated n-layer and back transparent conductive oxide for a-Si:H/mu c-Si:H tandem cellsen_US
dc.typeArticleen_US

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