High performance band-pass filter embedded into SoCs using VLSI backend interconnects and high resistivity silicon substrate
| dc.citation.epage | 29 | en_US |
| dc.citation.spage | 27 | en_US |
| dc.contributor.author | Chen, C. C. | en_US |
| dc.contributor.author | Chin, Albert | en_US |
| dc.contributor.author | Yang, M. T. | en_US |
| dc.contributor.author | Liu, Sally | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:24:43Z | |
| dc.date.available | 2014-12-08T15:24:43Z | |
| dc.date.issued | 2006 | en_US |
| dc.description.abstract | High performance band-pass filters are demonstrated on VLSI incorporating interconnects and high resistivity substrate. The resonating frequency of this coupled-line filter increases not only with the increasing spacing-gap but also with increasing IDM thickness. This band-pass filter, low insertion loss and wide bandwidth characteristics, are suitable for the advanced wireless system. The established equivalent circuit model for this band-pass filter corresponds with the measured results and provides effectively RIF passive components embedded into system-on-a-chips. | en_US |
| dc.identifier.doi | 10.1145/1178782.1178788 | en_US |
| dc.identifier.isbn | 1-4244-0103-8 | en_US |
| dc.identifier.journal | Proceedings of the IEEE 2006 International Interconnect Technology Conference | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1145/1178782.1178788 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/17159 | |
| dc.identifier.wosnumber | WOS:000238974400008 | |
| dc.language.iso | en_US | en_US |
| dc.title | High performance band-pass filter embedded into SoCs using VLSI backend interconnects and high resistivity silicon substrate | en_US |
| dc.type | Proceedings Paper | en_US |