Novel Cu-to-Cu Bonding With Ti Passivation at 180 degrees C in 3-D Integration
| dc.citation.epage | 1553 | en_US |
| dc.citation.issue | 12 | en_US |
| dc.citation.spage | 1551 | en_US |
| dc.citation.volume | 34 | en_US |
| dc.citation.woscount | 0 | |
| dc.contributor.author | Huang, Yan-Pin | en_US |
| dc.contributor.author | Chien, Yu-San | en_US |
| dc.contributor.author | Tzeng, Ruoh-Ning | en_US |
| dc.contributor.author | Shy, Ming-Shaw | en_US |
| dc.contributor.author | Lin, Teu-Hua | en_US |
| dc.contributor.author | Chen, Kou-Hua | en_US |
| dc.contributor.author | Chiu, Chi-Tsung | en_US |
| dc.contributor.author | Chiou, Jin-Chern | en_US |
| dc.contributor.author | Chuang, Ching-Te | en_US |
| dc.contributor.author | Hwang, Wei | en_US |
| dc.contributor.author | Tong, Ho-Ming | en_US |
| dc.contributor.author | Chen, Kuan-Neng | en_US |
| dc.contributor.department | 交大名義發表 | zh_TW |
| dc.contributor.department | National Chiao Tung University | en_US |
| dc.date.accessioned | 2014-12-08T15:33:26Z | |
| dc.date.available | 2014-12-08T15:33:26Z | |
| dc.date.issued | 2013-12-01 | en_US |
| dc.description.abstract | A novel CMOS-compatible bond structure using Cu-to-Cu bonding with Ti passivation is demonstrated at low temperature and investigated. With the Ti protection of inner Cu, Cu bonding temperature can be reduced to 180 degrees C. In addition, excellent electrical stability against humidity and temperature cycling is achieved. Diffusion behavior and mechanism of Cu and Ti are also discussed. With excellent bond results and reliability, this bonded scheme has the potential to be applied in 3-D integration. | en_US |
| dc.identifier.doi | 10.1109/LED.2013.2285702 | en_US |
| dc.identifier.issn | 0741-3106 | en_US |
| dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/LED.2013.2285702 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/23230 | |
| dc.identifier.wosnumber | WOS:000327640400029 | |
| dc.language.iso | en_US | en_US |
| dc.subject | 3-D integration | en_US |
| dc.subject | Cu bonding | en_US |
| dc.subject | Ti passivation | en_US |
| dc.title | Novel Cu-to-Cu Bonding With Ti Passivation at 180 degrees C in 3-D Integration | en_US |
| dc.type | Article | en_US |