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Extended microtunnels in GaN prepared by wet chemical etch

dc.citation.epageen_US
dc.citation.issue20en_US
dc.citation.volume89en_US
dc.citation.woscount14
dc.contributor.authorHuang, Hsin-Hsiungen_US
dc.contributor.authorZeng, Hung-Yuen_US
dc.contributor.authorLee, Chi-Lingen_US
dc.contributor.authorLee, Shih-Changen_US
dc.contributor.authorLee, Wei-Ien_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.date.accessioned2014-12-08T15:15:23Z
dc.date.available2014-12-08T15:15:23Z
dc.date.issued2006-11-13en_US
dc.description.abstractIt is demonstrated in GaN that microtunnels extended beyond hundreds of microns can be easily achieved using wet chemical etch. To obtain this result, specially designed structures of GaN layers are first grown on sapphire substrates with metal-organic chemical vapor deposition and subsequently with hydride vapor phase epitaxy techniques. The prepared samples are then chemically etched in molten KOH. With the designed structure of GaN layers, extended microtunnels with triangular cross sections are formed. The crystallographic planes of the triangular bevels belong to the {11(2) over bar 2} family. The etch rate of the tunnel can be as high as 10 mu m/min at proper etching conditions. (c) 2006 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2374841en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2374841en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/11551
dc.identifier.wosnumberWOS:000242100200049
dc.language.isoen_USen_US
dc.titleExtended microtunnels in GaN prepared by wet chemical etchen_US
dc.typeArticleen_US

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