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Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing

dc.citation.epage263en_US
dc.citation.issueen_US
dc.citation.spage261en_US
dc.citation.volume124en_US
dc.citation.woscount0
dc.contributor.authorLin, C. K.en_US
dc.contributor.authorLiu, Chien-Mingen_US
dc.contributor.authorChen, Chihen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:36:03Z
dc.date.available2014-12-08T15:36:03Z
dc.date.issued2014-06-01en_US
dc.description.abstractThis study examined the formation of Sn-rich phases in the matrix of Cu-Sn-Ni intermetallic compounds (IMCs) after current stressing of 1.2 X 104 A/cm(2) at 160 degrees C. The Sn-rich phases were formed at the cathode end of the solder joints with Cu metallization, and this formation was attributed to the decomposition of Cu6Sn5 IMCs. When the Cu6Sn5 IMCs were transformed into Cu3Sn during current stressing, Sn atoms were released. When the supply of Cu atoms became deficient, Sn atoms accumulated to form Sn-rich phases among the Cu-Sn-Ni IMCs. (C) 2014 Elsevier B.V. All rights reserved.en_US
dc.identifier.doi10.1016/j.matlet.2014.03.071en_US
dc.identifier.issn0167-577Xen_US
dc.identifier.journalMATERIALS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.matlet.2014.03.071en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/24400
dc.identifier.wosnumberWOS:000336464400071
dc.language.isoen_USen_US
dc.subjectPhase transformationen_US
dc.subjectMetallic compositesen_US
dc.subjectIntermetallic compounden_US
dc.subjectSolderen_US
dc.subjectElectromigrationen_US
dc.titleFormation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressingen_US
dc.typeArticleen_US

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