高階助聽器晶片及系統-總計畫( II )

dc.contributor.author	吳介琮	en_US
dc.contributor.author	WU JIEH-TSORNG	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
dc.date.accessioned	2014-12-13T10:43:05Z
dc.date.available	2014-12-13T10:43:05Z
dc.date.issued	2011	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC100-2220-E009-014	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2363305&docId=374213	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/99589
dc.language.iso	zh_TW	en_US
dc.subject	助聽器	zh_TW
dc.subject	數位訊號處理器	zh_TW
dc.subject	低功率晶片系統	zh_TW
dc.subject	混合訊號式積體電路	zh_TW
dc.subject	微機電。	zh_TW
dc.subject	Hearing Aids	en_US
dc.subject	Digital Signal Processor	en_US
dc.subject	Low-Power System on a Chip	en_US
dc.subject	Mixed-Signal Integrated Circuits	en_US
dc.subject	MEMS.	en_US
dc.title	高階助聽器晶片及系統-總計畫( II )	zh_TW
dc.title	Advanced Hearing Aid Soc and System	en_US
dc.type	Plan	en_US

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