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製作低溫450℃複晶矽薄膜電晶體之關鍵技術---主動層(Active Layer)及源/汲接面(Junction)之研製

dc.contributor.author鄭晃忠en_US
dc.contributor.authorCHENG HUANG-CHUNGen_US
dc.contributor.department交通大學電子工程研究所zh_TW
dc.date.accessioned2014-12-13T10:37:06Z
dc.date.available2014-12-13T10:37:06Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2215-E009-057zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=428954&docId=76772en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94386
dc.language.isozh_TWen_US
dc.subject複晶矽薄膜電晶體zh_TW
dc.subject主動層zh_TW
dc.subject低溫zh_TW
dc.subject準分子雷射zh_TW
dc.subject摻雜zh_TW
dc.subject退火zh_TW
dc.subjectPolysilicon TFTen_US
dc.subjectActive layeren_US
dc.subjectLow-temperatureen_US
dc.subjectExcimer laseren_US
dc.subjectDopingen_US
dc.subjectAnnealingen_US
dc.title製作低溫450℃複晶矽薄膜電晶體之關鍵技術---主動層(Active Layer)及源/汲接面(Junction)之研製zh_TW
dc.titleKey Technologies of Low-Temperature(<450.degree.C) Poly-Si Thin Film Transistors---Research and Fabrication of Active Layers and Source/Drain Junctionsen_US
dc.typePlanen_US

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