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Fabrication of location-controlled silicon crystal grains by combining excimer laser irradiation with nanometer-sized A-Si

dc.citation.epage546en_US
dc.citation.spage541en_US
dc.citation.volume910en_US
dc.contributor.authorTsai, Chun-Chienen_US
dc.contributor.authorChang, Ting-Kuoen_US
dc.contributor.authorChen, Hsiu-Hsinen_US
dc.contributor.authorChen, Bo-Tingen_US
dc.contributor.authorCheng, Huang-Chungen_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.date.accessioned2014-12-08T15:10:20Z
dc.date.available2014-12-08T15:10:20Z
dc.date.issued2007en_US
dc.description.abstractIn this paper, location-controlled silicon crystal grains are fabricated by a novel excimer laser crystallization method. An array of 1.8-mu m-sized disk-liked grains are formed by this method, and the high-performance n-channel LTPS TFTs with field-effect-mobility reaching 308 cm(2)/Vs can be, fabricated owing to the artificially-controlled lateral grain growth. This position-manipulated silicon grains are essential to high performance and good uniformity thin film transistors.en_US
dc.identifier.isbn978-1-55899-866-7en_US
dc.identifier.issn0272-9172en_US
dc.identifier.journalAmorphous and Polycrystalline Thin-Film Silicon Science and Technology 2006en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/7890
dc.identifier.wosnumberWOS:000245670700077
dc.language.isoen_USen_US
dc.titleFabrication of location-controlled silicon crystal grains by combining excimer laser irradiation with nanometer-sized A-Sien_US
dc.typeProceedings Paperen_US

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