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公開日期標題作者
20-十二月-2017Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void FormationChang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
15-十月-2019Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium HeatingHuang, E-Wen; Chou, Hung-Sheng; Tu, K. N.; Hung, Wei-Song; Tu-Ngoc Lam; Tsai, Che-Wei; Chiang, Ching-Yu; Lin, Bi-Hsuan; Yeh, An-Chou; Chang, Shan-Hsiu; Chang, Yao-Jen; Yang, Jun-Jie; Li, Xiao-Yun; Ku, Ching-Shun; An, Ke; Chang, Yuan-Wei; Jao, Yu-Lun; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
15-五月-2019Multi-scale mapping for collagen-regulated mineralization in bone remodeling of additive manufacturing porous implantsTsai, Pei-I.; Lam, Tu-Ngoc; Wu, Meng-Huang; Tseng, Kuan-Ying; Chang, Yuan-Wei; Sun, Jui-Sheng; Li, Yen-Yao; Lee, Ming-Hsueh; Chen, San-Yuan; Chang, Chung-Kai; Su, Chun-Jen; Lin, Chia-Hsien; Chiang, Ching-Yu; Ku, Ching-Shun; Tsou, Nien-Ti; Shih, Shao-Ju; Wang, Chun-Chieh; Huang, E-Wen; 材料科學與工程學系; Department of Materials Science and Engineering
12-四月-2018A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsChang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2013Photodegradation by a Heterogeneous Mixture of Micro-Sized Anatase and Truncated Rhomboid Anatase Hollow SpheresYang, Min-Han; Tsai, Min-Chiao; Chang, Yuan-Wei; Chang, Ya-Chen; Chiu, Hsin-Tien; Lee, Chi-Young; 應用化學系; Department of Applied Chemistry
15-五月-2012Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packagingYang, Ruo-Wei; Chang, Yuan-Wei; Sung, Wei-Chi; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2016Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element ModelingChang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
15-九月-2016Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modelingChang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2012Thermomigration in solder jointsChen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-五月-2012Thermomigration of Ti in flip-chip solder jointsChen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2013以凱文錫球結構及有限元素分析法研究覆晶銲錫凸塊與微凸塊的電遷移破壞機制張元蔚; Chang, Yuan-Wei; 陳智; Chen, Chih; 材料科學與工程學系所
顯示 3 到 13 筆資料，總共 13 筆 < 上一頁