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Issue DateTitleAuthor(s)
1999Anti-reflection strategies for sub-0.18-mu m dual damascene structure patterning in KrF 248nm lithographyChou, SY; Wang, CM; Hsia, CC; Chen, LJ; Hwang, GW; Lee, SD; Lou, JC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-1999Barrier capabilities of selective chemical vapor deposited W films and WSiN/WSix/W stacked layers against Cu diffusionWang, MT; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2-Nov-1998Characterization of multilayered Ti/TiN films grown by chemical vapor depositionHu, JC; Chang, TC; Chen, LJ; Yang, YL; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
31-Oct-1997Characterization of TiN film grown by low-pressure-chemical-vapor-depositionMei, YJ; Chang, TC; Hu, JC; Chen, LJ; Yang, YL; Pan, FM; Wu, WF; Ting, A; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
-Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-Oct-1997Chemical mechanical polishing for selective CVD-WWang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2005Coherent control multiphoton processes in semiconductor saturable Bragg reflector with freezing phase algorithmChen, MC; Huang, JY; Chen, LJ; 光電工程學系; Department of Photonics
1-Mar-2000Copper electroplating for future ultralarge scale integration interconnectionGau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-2000Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)Gau, WC; Chang, TC; Lin, YS; Hu, JC; Chen, LJ; Chang, CY; Cheng, CL; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2000Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applicationsHu, JC; Chang, TC; Wu, CW; Chen, LJ; Hsiung, CS; Hsieh, WY; Lur, W; Yew, TR; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2000Effects of composition and N-2 plasma treatment on the barrier effectiveness of chemically vapor deposited WSix filmsWang, MT; Chuang, MH; Chen, LJ; Chen, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
31-Oct-1997Effects of corrosion environments on the surface finishing of copper chemical mechanical polishingWang, MT; Tsai, MS; Liu, C; Tseng, WT; Chang, TC; Chen, LJ; Cheng, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
20-Oct-1997Effects of isolation materials on facet formation for silicon selective epitaxial growthTseng, HC; Chang, CY; Pan, FM; Chen, JR; Chen, LJ; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-1999Electrical reliability issues of integrating thin Ta and TaN barriers with Cu and low-K dielectricWu, ZC; Wang, CC; Wu, RG; Liu, YL; Chen, PS; Zhu, ZM; Chen, MC; Chen, JF; Chang, CI; Chen, LJ; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
10-Dec-2001Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density currentLin, HH; Cheng, SL; Chen, LJ; Chen, C; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
2001Evaluating the impact of spherical aberration on sub-0.2-micron contact/via hole patterningChou, SY; Lou, JC; Lai, CM; Liang, FJ; Chen, LJ; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2005Fabrication of NiSi2 nanocrystals embedded in SiO2 with memory effect by oxidation of the amorphous Si/Ni/SiO2 structureYeh, PH; Wu, HH; Yu, CH; Chen, LJ; Liu, PT; Hsu, CH; Chang, TC; 光電工程學系; Department of Photonics
1-Nov-2001Focus latitude enhancement of symmetrical phase mask design for deep submicron contact hole patterningChou, SY; Lou, JC; Chen, LJ; Shiu, LH; Liu, RG; Wang, CM; Gau, TS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 20 of 24  next >