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Issue DateTitleAuthor(s)
1-Jun-2001Application of A1/PI composite bumps to COG bonding processJeng, JH; Hsieh, TE; 材料科學與工程學系; Department of Materials Science and Engineering
1-Mar-2006Comparison of characteristics and integration of copper diffusion-barrier dielectricsWang, TC; Cheng, YL; Wang, YL; Hsieh, TE; Hwang, GJ; Chen, CF; 材料科學與工程學系; Department of Materials Science and Engineering
30-Jan-2004Copper surface protection with a completely enclosed copper structure for a damascene processWang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW; 材料科學與工程學系; Department of Materials Science and Engineering
15-Nov-1999Defects in Ge+-preamorphized siliconChen, PS; Hsieh, TE; Hwang, YC; Chu, CH; 材料科學與工程學系; Department of Materials Science and Engineering
2000Development of rewritable dual-layer phase-change optical disksWu, FH; Hsieh, TE; Shieh, HPD; 光電工程學系; Department of Photonics
1-Sep-2004Direct COSi2 thin-film formation with homogeneous nanograin-size distribution by oxide-mediated silicidationChang, JJ; Liu, CP; Chen, SW; Chang, CC; Hsieh, TE; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
10-Apr-2003The effect of composition on Ba-Nd-Sm-Ti-O microwave dielectric materials for LTCC applicationCheng, CC; Hsieh, TE; Lin, IN; 材料科學與工程學系; Department of Materials Science and Engineering
2005The effect of organo-functional silanes on the adhesion of epoxide resins to ITO glassChiang, TH; Hsieh, TE; 材料科學與工程學系; Department of Materials Science and Engineering
2004Effects of composition on low temperature sinterable Ba-Nd-Sm-Ti-O microwave dielectric materialsCheng, CC; Hsieh, TE; Lin, IN; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-1999Effects of morphology and surface characteristics of poly(imide siloxane)s and deep UV/O-3 surface treatment on the interfacial adhesion of poly(imide siloxane)/alloy-42 leadframe jointsJwo, SL; Whang, WT; Hsieh, TE; Pan, FM; Liaw, WC; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-2004Electroless copper/nickel films deposited on AIN substratesLiang, MW; Hsieh, TE; Chen, CC; Hung, YT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Aug-2004Enhancement of data transfer rate of phase change optica disk by doping nitrogen in Ge-In-Sb-Te recording layerYeh, TT; Hsieh, TE; Shieh, HPD; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
1-Sep-2004Enhancing the overwriting characteristics of phase-change optical disks by doping in dielectric layersYu, CH; Hsieh, TE; Yeh, TT; Shieh, HPD; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
1-Mar-1999Initialization characteristics and their effects on the erasability of phase change optical disks using transmission electron microscopyChen, HW; Hsieh, TE; Liu, JR; Shieh, HPD; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
1-Mar-2001Mask films for thermally induced superresolution readout in rewritable phase-change optical disksLu, YH; Dimitrov, D; Liu, JR; Hsieh, TE; Shieh, HPD; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
15-Nov-2000Mechanical properties of clay-polyimide (BTDA-ODA) nanocomposites via ODA-modified organoclayTyan, HL; Wei, KH; Hsieh, TE; 材料科學與工程學系; Department of Materials Science and Engineering
15-Jul-2005A method to enhance the data transfer rate of eutectic Sb-Te phase-change recording mediaYeh, TT; Hsieh, TE; Shieh, HPD; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
2004A method to enhance the data transfer rate of phase change recording mediaYeh, TT; Hsieh, TE; Shieh, HPD; 材料科學與工程學系; Department of Materials Science and Engineering
2003Microwave dielectric properties of glass-ceramic composites for low temperature co-firable ceramicsCheng, CC; Hsieh, TE; Lin, IN; 材料科學與工程學系; Department of Materials Science and Engineering
24-Jan-2005Modified polycrystalline silicon chemical-vapor deposition process for improving roughness at oxide/polycrystalline silicon interfaceChang, JJ; Hsieh, TE; Wang, YL; Tseng, WT; Liu, CP; Lan, CY; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 20 of 37  next >