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顯示 1 到 17 筆資料，總共 17 筆
公開日期標題作者
1-五月-2006Design and anaylsis of a 2.5-Gbps optical receiver analog front-end in a 0.35-mu m digital CMOS technologyChen, WZ; Lu, CH; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-二月-2007Effect of plasma treatment on the microstructure and electrical properties of MIM capacitors with PECVD silicon oxide and silicon nitrideHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-一月-2008Effect of size and plasma treatment and the application of Weibull distribution on the breakdown of PECVD SiNx MIM capacitorsHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-十二月-2008Effects of annealing temperature on the resistance switching behavior of CaCu(3)Ti(4)O(12) filmsShen, Yu-Shu; Chiou, Bi-Shiou; Ho, Chia-Cheng; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-十二月-2008Effects of annealing temperature on the resistance switching behavior of CaCu3Ti4O12 filmsShen, Yu-Shu; Chiou, Bi-Shiou; Ho, Chia-Cheng; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-四月-2007Effects of plasma treatment on the high frequency characteristics of Cu/Ta/hydrogen silsesquioxane (HSQ) system and electrical behaviors of Cu/Ta/HSQ/Pt MIM capacitorsHo, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-九月-2005Electrical Behavior of BaO-Nd2O3-SM2O3-TiO2 with glass/oxide additives analyzed by impedance spectroscopyChang, LC; Chiou, BS; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-一月-2009Impedance Spectroscopy of CaCu(3)Ti(4)O(12) Films Showing Resistive SwitchingShen, Yu-Shu; Ho, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-一月-2009Impedance Spectroscopy of CaCu3Ti4O12 Films Showing Resistive SwitchingShen, Yu-Shu; Ho, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
15-三月-2008Improving dielectric loss and enhancing figure of merit of Ba0.5Sr0.5Ti0.95Mg0.05O3 thin films doped by aluminumLee, Shean-Yih; Chiou, Bi-Shiou; Lu, Horng-Hwa; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-一月-2008Improving dielectric loss and thermal stability of CaCu(3)Ti(4)O(12) thin films by adding BST layerLee, Shean-Yih; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-一月-2008Improving dielectric loss and thermal stability of CaCu3Ti4O12 thin films by adding BST layerLee, Shean-Yih; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
15-十二月-2007Microstructure evolution and dielectric properties of Ba0.7Sr0.3TiO3 parallel plate capacitor with Cr interlayerHo, Chia-Cheng; Chiou, Bi-Shiou; Chang, Li-Chun; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
1-三月-2006S-parameters-based high speed signal characterization of Al interconnect on low-k hydrogen silsesquioxane-Si substrateHo, CC; Chiou, BS; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
20-十二月-2006Thermal stability and electric properties of Ba0.7Sr0.3TiO3 parallel plate capacitor with nano-Cr interlayerHo, Chia-Cheng; Chiou, Bi-Shiou; Chang, Li-Chun; Chou, Chen-Chia; Liou, Bo-Heng; Yu, Chin-Chieh; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
26-三月-2007Thickness effects on the electrical characteristics of Ba0.7Sr0.3TiO3 capacitors with nano-Cr interlayerHo, Chia-Cheng; Chiou, Bi-Shiou; Chang, Li-Chun; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
3-十二月-2007Thickness-dependent microstructures and electrical properties of CaCu3Ti4O12 films derived from sol-gel processChang, Li-Chun; Lee, Dai-Ying; Ho, Chia-Cheng; Chiou, Bi-Shiou; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
顯示 1 到 17 筆資料，總共 17 筆