Browsing by Subject A1/PI composite bumps
Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
|---|---|---|
| 1-Jun-2001 | Application of A1/PI composite bumps to COG bonding process | Jeng, JH; Hsieh, TE; 材料科學與工程學系; Department of Materials Science and Engineering |