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Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
1-Mar-2019Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2018Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Yang, Yu-Tao; Chen, Yu-Pei; Chen, Chiao-Pei; Hung, Tsung-Tai; Chen, Chiu-Feng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2019Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous IntegrationLu, Cheng-Hsien; Jhu, Shu-Yan; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chuan-An; Huang, Yen-Jun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2011三維積體電路(3D IC)之矽晶直通孔(TSV)與其它關鍵技術製程整合研究及應力量測熱傳導模型分析( II )陳冠能; CHEN KUAN-NENG; 國立交通大學電子工程學系及電子研究所
2017三維積體電路異質整合技術開發之聚醯亞胺材料與鈍化層附著強度以及鈷金屬超薄緩衝層應用於混合接合之研究許浴桐; 陳冠能; Kho, Yi-Tung; Chen, Kuan-Neng; 電機資訊國際學程
Showing results 1 to 6 of 6