標題: Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration
作者: Lu, Cheng-Hsien
Kho, Yi-Tung
Chen, Chiao-Pei
Tsai, Bin-Ling
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Adhesion;four-point bending;hybrid bonding;polyimide;X-ray photoelectron spectroscopy (XPS)
公開日期: 1-三月-2019
摘要: This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 degrees C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.
URI: http://dx.doi.org/10.1109/TCPMT.2019.2895515
http://hdl.handle.net/11536/149028
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2019.2895515
期刊: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume: 9
起始頁: 412
結束頁: 418
顯示於類別:期刊論文