標題: | Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration |
作者: | Lu, Cheng-Hsien Kho, Yi-Tung Chen, Chiao-Pei Tsai, Bin-Ling Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Adhesion;four-point bending;hybrid bonding;polyimide;X-ray photoelectron spectroscopy (XPS) |
公開日期: | 1-三月-2019 |
摘要: | This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 degrees C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration. |
URI: | http://dx.doi.org/10.1109/TCPMT.2019.2895515 http://hdl.handle.net/11536/149028 |
ISSN: | 2156-3950 |
DOI: | 10.1109/TCPMT.2019.2895515 |
期刊: | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY |
Volume: | 9 |
起始頁: | 412 |
結束頁: | 418 |
顯示於類別: | 期刊論文 |