標題: Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding
作者: Lu, Cheng-Hsien
Yang, Yi-Lun
Chen, Chiao-Pei
Tsai, Bin-Ling
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Polyimides;Adhesives;Plating;Metals;Packaging;Adhesion;electroplating;polyimide;X-ray photoelectron spectroscopy (XPS)
公開日期: 1-一月-2020
摘要: This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.
URI: http://dx.doi.org/10.1109/TCPMT.2019.2942128
http://hdl.handle.net/11536/153738
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2019.2942128
期刊: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume: 10
Issue: 1
起始頁: 168
結束頁: 175
顯示於類別:期刊論文