標題: | Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding |
作者: | Lu, Cheng-Hsien Yang, Yi-Lun Chen, Chiao-Pei Tsai, Bin-Ling Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Polyimides;Adhesives;Plating;Metals;Packaging;Adhesion;electroplating;polyimide;X-ray photoelectron spectroscopy (XPS) |
公開日期: | 1-Jan-2020 |
摘要: | This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes. |
URI: | http://dx.doi.org/10.1109/TCPMT.2019.2942128 http://hdl.handle.net/11536/153738 |
ISSN: | 2156-3950 |
DOI: | 10.1109/TCPMT.2019.2942128 |
期刊: | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY |
Volume: | 10 |
Issue: | 1 |
起始頁: | 168 |
結束頁: | 175 |
Appears in Collections: | Articles |