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公開日期標題作者
1-十二月-2018400Mbit/s OOK green-LED visible light communication with low illuminationYeh, C. H.; Chow, C. W.; Gu, C. S.; Guo, B. S.; Chang, Y. J.; Weng, J. H.; Wu, M. C.; 光電工程學系; 光電工程研究所; Department of Photonics; Institute of EO Enginerring
2012Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D InterconnectsChen, K. N.; Chang, Y. J.; Ko, C. T.; Hsu, S. Y.; Chen, H. Y.; Hsiao, C.; Yu, T. H.; Chen, Y. H.; Lo, W. C.; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2010Novel Design of Interactive Caption and Recognition Postures within the Wearable and Non-Vision System over Wireless Sensor NetworkHuang, W. T.; Hung, C. N.; Tuan, C. C.; Chen, C. C.; Chang, Y. J.; Chen, Y. Y.; 電控工程研究所; Institute of Electrical and Control Engineering
1-六月-2019Single-mode erbium fiber dual-ring laser with 60-nm workable wavelength tunabilityYang, Y. L.; Yeh, C. H.; Tsai, C. K.; Xie, Y. R.; Lue, C. M.; Chang, Y. J.; Chen, J. H.; Chow, C. W.; 光電工程學系; 光電工程研究所; Department of Photonics; Institute of EO Enginerring
2012Structural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Wafer BondingKo, C. T.; Hsiao, Z. C.; Chang, Y. J.; Chen, P. S.; Huang, J. H.; Fu, H. C.; Huang, Y. J.; Chiang, C. W.; Lee, C. K.; Chang, H. H.; Tsai, W. L.; Chen, Y. H.; Lo, W. C.; Chen, K. N.; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
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