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2013Comparison of H-2 and NH3 Treatments for Copper InterconnectsChang, Yu-Min; Leu, Jihperng; Lin, Bing-Hong; Wang, Ying-Lung; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2013Effect of Moisture on Electrical and Reliability Characteristics for Dense and Porous Low-k DielectricsCheng, Yi-Lung; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2014Effect of moisture on electrical properties and reliability of low dielectric constant materialsCheng, Yi-Lung; Leon, Ka-Wai; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2014Effect of NH3/N-2 ratio in plasma treatment on porous low dielectric constant SiCOH materialsHuang, Jun-Fu; Bo, Tain-Cih; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
15-一月-2013Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectricsChang, Yu-Min; Chang, Wei-Yuan; Huang, Jun-Fu; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2014Effect of UV curing time on physical and electrical properties and reliability of low dielectric constant materialsKao, Kai-Chieh; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2013Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH materialCheng, Yi-Lung; Huang, Jun-Fu; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1996變形整合測量反算分析模式張裕民; Chang, Yu-Min; 陳春盛; Chun Sung Chen; 土木工程學系
顯示 1 到 8 筆資料，總共 8 筆