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公開日期標題作者
1-一月-2007The brand-new high density "NCF=-type compliant-bumped COG" in high resolution LCDChang, Shyh-Ming; Kao, Kuo-Shu; An, Chao-Chyun; Chen, Ming-Yao; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Wen-Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-四月-2017Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current StressingChen, Ming-Yao; Lin, Han-wen; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
四月-2016Electromigration in reduced-height solder joints with Cu pillarsChen, Ming-Yao; Liang, Y. C.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2007Fine pitch "NCF-type Compliant-bumped COG"An, Chao-Chyun; Chang, Shyh-Ming; Chen, Ming-Yao; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Ren-Haw; Chen, Wen-Chih; 機械工程學系; 材料科學與工程學系; Department of Mechanical Engineering; Department of Materials Science and Engineering
2007Theoretical stress calculation and experimental results of "NCF-type compliant-bumped COG"Chen, Ming-Yao; An, Chao-Chyun; Chang, Shyh-Ming; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; 機械工程學系; 材料科學與工程學系; Department of Mechanical Engineering; Department of Materials Science and Engineering
2017錫的微結構對覆晶封裝銲錫接點的電遷移破壞之影響陳酩堯; 陳智; Chen, Ming-Yao; Chen, Chih; 材料科學與工程學系所
顯示 1 到 6 筆資料，總共 6 筆