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公開日期標題作者
13-八月-2013Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereofChen Kuan-Neng; Hsu Sheng-Yao
14-三月-2013ELECTRICAL TEST STRUCTURE APPLYING 3D-ICS BONDING TECHNOLOGY FOR STACKING ERROR MEASUREMENTChen Kuan-Neng; Li Shih-Wei
1-十月-2013Electrical test structure applying 3D-ICS bonding technology for stacking error measurementChen Kuan-Neng; Li Shih-Wei
21-六月-2012ESD PROTECTION STRUCTURE FOR 3D ICChen Kuan-Neng; Lai Ming-Fang; Chen Hung-Ming
17-九月-2013Heterostructure containing IC and LED and method for fabricating the sameChen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung
25-三月-2014Heterostructure containing IC and LED and method for fabricating the sameChen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung
4-七月-2013Integrated Circuit DeviceChen Kuan-Neng; Lai Ming-Fang; Chen Hung-Ming
18-二月-2014Integrated circuit deviceChen Kuan-Neng; Lai Ming-Fang; Chen Hung-Ming
5-二月-2015INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICEChen Kuan-Neng; Chang Yao-Jen
10-二月-2015Submicron connection layer and method for using the same to connect wafersChen Kuan-Neng; Chang Yao-Jen
13-Sep-2012THREE-DIMENSIONAL COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICEChen Kuan-Neng; Chang Yao-Jen
26-Jun-2014THREE-DIMENSIONAL INTEGRATED CIRCUITTan An-Nan; Chen Hung-Ming; Chen Kuan-Neng
Showing results 1 to 12 of 12