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公開日期標題作者
1-三月-2012Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D IntegrationChen, Kuan-Neng; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Fu, Huan-Chun; Lo, Wei-Chung; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2014A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor DevicesKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLPShen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2012A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory ApplicationKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
顯示 1 到 5 筆資料，總共 5 筆