瀏覽 的方式： 作者 Hsiao, Zhi-Cheng
顯示 1 到 4 筆資料，總共 4 筆
| 公開日期 | 標題 | 作者 |
| 1-三月-2012 | Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration | Chen, Kuan-Neng; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Fu, Huan-Chun; Lo, Wei-Chung; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2013 | Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding | Chang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-六月-2014 | A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices | Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-六月-2012 | A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application | Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
