瀏覽 的方式: 作者 Huang, Jun-Fu

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公開日期標題作者
1-一月-2013Effect of Moisture on Electrical and Reliability Characteristics for Dense and Porous Low-k DielectricsCheng, Yi-Lung; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2014Effect of moisture on electrical properties and reliability of low dielectric constant materialsCheng, Yi-Lung; Leon, Ka-Wai; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2014Effect of NH3/N-2 ratio in plasma treatment on porous low dielectric constant SiCOH materialsHuang, Jun-Fu; Bo, Tain-Cih; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
15-一月-2013Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectricsChang, Yu-Min; Chang, Wei-Yuan; Huang, Jun-Fu; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2013Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH materialCheng, Yi-Lung; Huang, Jun-Fu; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering