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顯示 1 到 8 筆資料，總共 8 筆
公開日期標題作者
1-一月-2014Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump InterconnectionsHuang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.; 材料科學與工程學系; Department of Materials Science and Engineering
2013A hybrid nanoparticle matrix for mass spectrometryLi, Po-Han; Huang, Shin-Yi; Chen, Yu-Chie; Urban, Pawel L.; 應用化學系; 應用化學系分子科學碩博班; Department of Applied Chemistry; Institute of Molecular science
19-三月-2013Magnetic Nanoparticle-Based Platform for Characterization of Histidine-Rich Proteins and PeptidesHuang, Shin-Yi; Chen, Yu-Chie; 應用化學系; Department of Applied Chemistry
1-一月-2018Optimization of laser release process for throughput enhancement of fan-out wafer-level packagingLee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Lin, Jim-Wein; Lin, Puru; Ko, Cheng-Ta; Chen, Yu-Hua; Shen, Wen-Wei; Kou, Tzu-Ying; Huang, Shin-Yi; Lin, Ang-Ying; Lin, Yu-Min; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-一月-2017Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLPShen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2019An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration ApplicationsLin, Yu-Min; Wu, Sheng-Tsai; Wang, Chun-Min; Lee, Chia-Hsin; Huang, Shin-Yi; Lin, Ang-Ying; Chang, Tao-Chih; Lin, Puru Bruce; Ko, Cheng-Ta; Chen, Yu-Hua; Su, Jay; Liu, Xiao; Prenger, Luke; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
1-一月-2018An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration ApplicationsLin, Yu-Min; Wu, Sheng-Tsai; Shen, Wen-Wei; Huang, Shin-Yi; Kuo, Tzu-Ying; Lin, Ang-Ying; Chang, Tao-Chih; Chang, Hsiang-Hung; Lee, Shu-Man; Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2018Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection TechnologyShen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng; 電子工程學系及電子研究所; 國際半導體學院; Department of Electronics Engineering and Institute of Electronics; International College of Semiconductor Technology
顯示 1 到 8 筆資料，總共 8 筆