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公開日期標題作者
1-一月-2007The brand-new high density "NCF=-type compliant-bumped COG" in high resolution LCDChang, Shyh-Ming; Kao, Kuo-Shu; An, Chao-Chyun; Chen, Ming-Yao; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Wen-Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2015Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder DiametersHsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
2007Fine pitch "NCF-type Compliant-bumped COG"An, Chao-Chyun; Chang, Shyh-Ming; Chen, Ming-Yao; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Ren-Haw; Chen, Wen-Chih; 機械工程學系; 材料科學與工程學系; Department of Mechanical Engineering; Department of Materials Science and Engineering
1-一月-2016Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder JointsLin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning; 材料科學與工程學系; Department of Materials Science and Engineering
2007Theoretical stress calculation and experimental results of "NCF-type compliant-bumped COG"Chen, Ming-Yao; An, Chao-Chyun; Chang, Shyh-Ming; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; 機械工程學系; 材料科學與工程學系; Department of Mechanical Engineering; Department of Materials Science and Engineering
2013覆晶銲錫之電遷移研究: 溫度對破壞機制的影響與電阻曲線之分析林宗寬; Lin, Chung-Kuang; 陳 智; Chen, Chih; 材料科學與工程學系所
顯示 1 到 6 筆資料，總共 6 筆