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公開日期標題作者
2005Barrier capability of HfN films with various nitrogen concentrations against copper diffusion in CuHf-N/n(+)-p junction diodesOu, KL; Chiou, SY; Lin, MH; Hsu, RQ; 機械工程學系; Department of Mechanical Engineering
1-一月-2005Comparative study of polycrystalline Ti, amorphous Ti, and multiamoIrphous Ti as a barrier film for Cu interconnectOu, KL; Yu, MS; Hsu, RQ; Lin, MH; 機械工程學系; Department of Mechanical Engineering
1-二月-2006Copper interconnect electromigration behavior in various structures and precise bimodal fittingLin, MH; Lin, YL; Chang, KP; Sul, KC; Wang, TH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2004A dynamic incentive pricing scheme for relaying services in multi-hop cellular networksLin, MH; Lo, CC; 資訊管理與財務金融系 註:原資管所+財金所; Department of Information Management and Finance
1-十二月-2005Electromigration lifetime improvement of copper interconnect by cap/dielectric interface treatment and geometrical designLin, MH; Lin, YL; Chen, JM; Yeh, MS; Chang, KP; Su, KC; Wang, TH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2002A prepaid service-based charging and billing protocol for Internet servicesLo, CC; Lin, MH; 資訊管理與財務金融系 註:原資管所+財金所; Department of Information Management and Finance
1998QoS provisioning in handoff algorithms for wireless LANLo, CC; Lin, MH; 資訊管理與財務金融系 註:原資管所+財金所; Department of Information Management and Finance
2005A quality of relay-based incentive pricing scheme for relaying services in multi-hop cellular networksLin, MH; Lo, CC; 資訊管理與財務金融系 註:原資管所+財金所; Department of Information Management and Finance