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顯示 1 到 6 筆資料，總共 6 筆
公開日期標題作者
2015Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfacesTseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
2016LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CUChen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
12-五月-2015Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned CuLiu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-五月-2014Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfacesLiu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-六月-2014A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor DevicesKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013三維積體電路關鍵技術 於先進背照式感光元件應用之研究呂典融; Lyu, Dian-Rong; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
顯示 1 到 6 筆資料，總共 6 筆