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公開日期標題作者
1-一月-2018Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copperJuang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2019Copper direct bonding with short time and excellent electrical property by < 111 >-oriented nano-twinned copperShie, Kai Cheng; Juang, Jing-Ye; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2020Instant Cu-to-Cu direct bonding enabled by < 111 >-oriented nanotwinned Cu bumpsShie, Kai Cheng; Juang, Jing-Ye; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2019Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copperJuang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2019Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copperJuang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2019Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned CuChen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 6 筆資料，總共 6 筆