標題: Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper
作者: Juang, Jing Ye
Shie, Kai Cheng
Li, Yu Jin
Tu, K. N.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Cu-to-Cu direct bonding;nanotwinned Cu;grain growth;Cu joint resistance;temperature cycling test
公開日期: 1-一月-2019
摘要: In this study, we present a chip-to-chip copper direct bonding technique in N-2 ambient, without vacuum by using (111) oriented nano-twinned copper. A well bonded copper joint was identified by the cross-sectioning process and microstructure observation. The cross-sectional images showed a void-less bonding interface in the bonded copper joint. In addition, we conducted resistance measurement using Kelvin probes on the bonded chip-to-chip test vehicle. The resistance for a daisy chain loop (400 joints) and the Kelvin structure (single joint) are 5.28 Omega and 4.14 m Omega, respectively. The contact resistivity is 3.98 x 10(-8) Omega.cm(2). More than 30% resistance reduction in the single Cu joint has been confirmed as compared to the SnAg solder joint (6.32 m Omega). Besides, temperature cycling test shows that the daisy chain loop with 400 Cu joints can stand the 1,000 cycles without failure. In summary, the chip-to-chip copper direct bonding in no-vacuum ambient has been successfully achieved by using (111) oriented nt-Cu. The low resistance as well as a reliable Cu-to-Cu joint can be achieved.
URI: http://hdl.handle.net/11536/153318
ISBN: 978-4-9902-1887-4
期刊: 2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)
起始頁: 212
結束頁: 215
顯示於類別:會議論文