標題: | Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu |
作者: | Juang, Jing-Ye Lu, Chia-Ling Li, Yu-Jin Tu, K. N. Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering |
關鍵字: | Cu-to-Cu direct bonding;nanotwinned Cu;surface diffusion;grain growth;shear strength |
公開日期: | 1-十二月-2018 |
摘要: | Highly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 degrees C/100 degrees C to 350 degrees C/100 degrees C in N-2 ambient conditions. The microstructures of the bonded interfaces affected the shear strength performance of the bonded Cu joints. The bonded interfaces at 300 degrees C/100 degrees C and 350 degrees C/100 degrees C had far fewer voids than interfaces bonded at 200 degrees C/100 degrees C and 250 degrees C/100 degrees C. In addition, grain growth took place across the bonding interfaces at temperatures above 300 degrees C/100 degrees C. The corresponding orientation map (OIM) showed the preferred orientation of large grown grains to be <100>. Shear tests revealed that the fracture mode was brittle for joints bonded at 200 degrees C/100 degrees C, but became ductile after bonded above 300 degrees C/100 degrees C. Based on the results, we found that voids and grain growth behavior play import roles in the shear strength performance of bonded Cu joints. |
URI: | http://dx.doi.org/10.3390/ma11122368 http://hdl.handle.net/11536/148750 |
ISSN: | 1996-1944 |
DOI: | 10.3390/ma11122368 |
期刊: | MATERIALS |
Volume: | 11 |
顯示於類別: | 期刊論文 |