標題: Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
作者: Juang, Jing-Ye
Lu, Chia-Ling
Li, Yu-Jin
Tu, K. N.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Cu-to-Cu direct bonding;nanotwinned Cu;surface diffusion;grain growth;shear strength
公開日期: 1-十二月-2018
摘要: Highly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 degrees C/100 degrees C to 350 degrees C/100 degrees C in N-2 ambient conditions. The microstructures of the bonded interfaces affected the shear strength performance of the bonded Cu joints. The bonded interfaces at 300 degrees C/100 degrees C and 350 degrees C/100 degrees C had far fewer voids than interfaces bonded at 200 degrees C/100 degrees C and 250 degrees C/100 degrees C. In addition, grain growth took place across the bonding interfaces at temperatures above 300 degrees C/100 degrees C. The corresponding orientation map (OIM) showed the preferred orientation of large grown grains to be <100>. Shear tests revealed that the fracture mode was brittle for joints bonded at 200 degrees C/100 degrees C, but became ductile after bonded above 300 degrees C/100 degrees C. Based on the results, we found that voids and grain growth behavior play import roles in the shear strength performance of bonded Cu joints.
URI: http://dx.doi.org/10.3390/ma11122368
http://hdl.handle.net/11536/148750
ISSN: 1996-1944
DOI: 10.3390/ma11122368
期刊: MATERIALS
Volume: 11
顯示於類別:期刊論文


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