標題: | Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu |
作者: | Lin, Han-wen Lu, Chia-ling Liu, Chien-min Chen, Chih Chen, Delphic Kuo, Jui-Chao Tu, K. N. 材料科學與工程學系 Department of Materials Science and Engineering |
關鍵字: | Intermetallic compounds;Soldering;Copper |
公開日期: | 1-八月-2013 |
摘要: | Anisotropic microstructure is becoming a critical issue in microbumps used in 3-D integrated circuit packaging. We report here an experimental approach for controlling the microstructure of eta-Cu6Sn5 intermetallic compound in microbumps by using < 1 1 1 > oriented and nanotwinned Cu pads as the under-bump-metallization. By electroplating arrays of large numbers of < 1 1 1 > oriented and nanotwinned Cu pads and by electroplating the Sn2.3Ag solder on the pads, we form eta-Cu6Sn5 in the reflow at 260 degrees C for 1 min. The eta-Cu6Sn5 showed a highly preferential growth along the < 0 0 0 1 > direction. As reflow time is extended, the preferred texture of eta-Cu6Sn5 changed to {2 (1) over bar (1) over bar 3}. The results indicate that we can control the uniform microstructure of eta-Cu6Sn5 intermetallic by controlling the microstructure of the Cu under-bump-metallization. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.actamat.2013.04.056 http://hdl.handle.net/11536/22157 |
ISSN: | 1359-6454 |
DOI: | 10.1016/j.actamat.2013.04.056 |
期刊: | ACTA MATERIALIA |
Volume: | 61 |
Issue: | 13 |
起始頁: | 4910 |
結束頁: | 4919 |
顯示於類別: | 期刊論文 |